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| Modeling and Simulation of Transverse FluxBased Induction Heating in Transverse Seal of Packaging Machine |
| LI Lei, WANG Shi-Gang, MO Jin-Qiu, WEI Xiao-Hui |
| (School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China) |
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Abstract Due to the issue of temperature distribution of transverse sealing in packaging machine, the temperature field of induction heating was analyzed through numerical modeling and calculation. Based on the principle of transverse flux induction, the equations and boundary conditions of the electromagnetic field and the temperature field were deduced. The process of transverse seal and the structure of aluminumpolyethylene composite package materials were considered. Furthermore, the mathematic and the finite element models of electromagnetic field and temperature field that apply to the transverse sealing of packaging machine were established. Using the finite element software ANSYS, the eddy current field and the temperature field were animated. By analyzing the temperature distribution of different directions in the sealsection of the package material, the simulation results show that the temperature distribution in the actual conditions meets the qualification of transverse seal and provide practical references for engineering application.
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Received: 01 June 2010
Published: 29 June 2011
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