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OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramic |
WANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu |
OrthogonalTesting Experimental on MicroUltrasonicMachining of MicrocrystallineMicaCeramicWANG Dan,ZHAO Wansheng,KANG Xiaoming,GU Lin,WEI Hongyu(School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China)Abstract: Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic(MCMC)slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.Key words: microultrasonicmachining (microUSM); microcrystallinemicaceramic (MCMC); orthogonaltesting |
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Abstract Microultrasonicmachining (microUSM) experiments were carried out on 530 μmthick microcrystallinemicaceramic(MCMC)slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonaltesting method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the microUSM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μmthick MCMC slice with the optimized microUSM parameters, and the taper of the hole is less than 0.5°.
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Received: 06 May 2009
Published: 29 January 2010
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