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| Lifetime Analysis of LeadFree Ball Grid Array Solder Joints under Random Vibration |
| WANG Wen, LIU Fang, YOU Ming-Yi, MENG Guang |
| (State Key Laboratory of Mechanical System and Vibration,Shanghai Jiaotong University, Shanghai 200240, China) |
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Abstract Four groups of random vibration tests of solder joints were conducted with different power spectral density (PSD) of input acceleration. Proportional hazards model (PHM) was used to evaluate the effect of PSD of input acceleration on the solder joints’ life span. The meantimetofailure (MTTF) and the failure probability density function (PDF) estimated from the PHM agree well with the experimental data, and this validates the effectiveness of the PHM. By the curve of the MTTF s, it can be observed that the MTTF<1 800 s when the amplitude of PSD was greater than 60 m2/s3, and this demonstrates that the lead-free solder joints are very sensitive to random vibration loading. Finally, the estimated lifetime of MTTF was integrated with the Miner’s law for cumulative damage model of lead-free solder joints.
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Received: 05 June 2010
Published: 30 September 2011
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