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Application of Water-Based Nano-Fluid in Copper Wire Flat Heat Pipe with Mesh Structure |
LI Shuang-Shuang, MA Qi, LIU Zhen-Hua |
(School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China) |
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Abstract The heat transfer characteristics of a novel flat heat pipe, the copper wire-bonded and mesh screen flat heat pipe ,were investigated experimentally. The effect of various working pressures, nano-fluid concentration and working fluids which include deionized water and waterbased copper nanofluids on copper wire-bonded and mesh screen flat heat pipe was analyzed. Besides, the performance was compared to that of copper wire-bonded flat heat pipe. The results show that nanofluid under low-pressure conditions can significantly improve the heat transfer characteristics of heat pipe and is a new working medium which can be applied to flat heat pipe. The overall thermal performances of new heat pipe are superior to those of copper wire-bonded flat heat pipe, the thermal resistance reduces distinctly and the maximum power increases obviously.
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Received: 29 August 2012
Published: 28 April 2013
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