Circuits and devices for standalone large-scale integration (LSI) chips and Internet of Things (IoT) applications: a review

Takaya Sugiura, Kenta Yamamura, Yuta Watanabe, Shiun Yamakiri, Nobuhiko Nakano

Chip ›› 2023, Vol. 2 ›› Issue (3) : 100048-13.

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Chip ›› 2023, Vol. 2 ›› Issue (3) : 100048-13. DOI: 10.1016/j.chip.2023.100048

Circuits and devices for standalone large-scale integration (LSI) chips and Internet of Things (IoT) applications: a review

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 2(3): 100048-13 https://doi.org/10.1016/j.chip.2023.100048

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