Wafer-scale engineering of two-dimensional transition metal dichalcogenides

Xiang Lan, Yingliang Cheng, Xiangdong Yang, Zhengwei Zhang

Chip ›› 2023, Vol. 2 ›› Issue (3) : 100057-14.

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Chip ›› 2023, Vol. 2 ›› Issue (3) : 100057-14. DOI: 10.1016/j.chip.2023.100057
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Wafer-scale engineering of two-dimensional transition metal dichalcogenides

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 2(3): 100057-14 https://doi.org/10.1016/j.chip.2023.100057

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