A temperature rise under high current tests can occur at the current contacts where the current must be transferred through the resistive sheath. The heat generated can trigger a quench effect initiated at the ends of the sample but propagating into the measurement zone between voltage taps [
6], [
15]. This is a widely reported problem, especially for gas-cooled measurements. To reduce the heating issue, we devised a sample mounting method, as shown in
Fig. 2(a). The round MgB
2 wire was soldered into two copper lugs with a 0.80 mm diameter hole for minimizing the possibility of temperature rise arising from current transfer. Then a piece of flat stainless steel (SS) was soldered to the copper lugs as well as the round MgB
2 wire, to improve the mechanical strength. A piece of copper (Cu) was attached to the MgB
2 wire for temperature sensor contact. In all
Ic tests, 60 mm long samples of each MgB
2 wire were used for measurement, as shown in
Fig. 2(b). Two pairs of voltage taps were soldered to the sample in the middle with 5 mm distance.
Fig. 2(c) gives the prepared sample mounted on the sample holder. With this sample mounting method, the heating issue was significantly reduced, but could not be eliminated completely considering the dimensions of the sample holder. Reliable measurements of
Ic were therefore limited to around 350 A for the small wires and 150 A to 200 A for the large wire. Similar limits were reproduced after testing multiple samples of each wire. The lower current limitation for the large wire may be due to its thicker sheath.