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| Thermal Design and Simulation of MOSFET in HighFrequency Power Supply Based on Thermal Resistance Network |
| HU Haila,WANG Shigang，MO Jinqiu,FAN Jinqiu |
| (School of Mechanical Engineering, Shanghai Jiaotong University, Shanghai 200240, China) |
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Abstract This paper described the thermal design of metaloxidesemiconductor fieldeffect transistor(MOSFET) which is typically applied in highfrequency power supply. After introducing the thermal parameters of MOSFET, the thermal risistance networks for single and couple pieces were established respectively, and further temperature formulations at each interface were deduced. Based on the above work, a suitable heat sink was figured out to solve the thermal problem in a highfrequence power supply which contains four MOSFETs compactively fix in a PCB. Finally, the performance of heat sink was verified with the help of computational fluid dynamics（CFD）software ICEPAK, and the thermal risistance networks are proved to be practical in engineering application
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Received: 16 February 2009
Published: 26 February 2010
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