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| ThreeDimensional Simulation Method of Mold Filling during Microchip Plastic Encapsulation |
| WANG Hui,ZHOU Huamin,LI Dequn |
| (State Key Laboratory of Materials Processing and Die & Mold Technology,Huazhong University of Science and Technology, Wuhan 430074, China) |
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Abstract In order to study the filling process of the plastic encapsulation, a stabilized three dimensional simulation method was presented. In this method, NS equations combined with Kamal conversion equation were introduced as governing equations, and FAN(Flow Analysis Network) technique was used to track melt fronts for each time step. To avoid numerical surge during calculation and achieve stabilized scheme, GLS(Galerkin Least Square) scheme was used in the momentum equation, GLS\\GGLS(Gradient Galerkin Least Square) scheme was used in the energy equation, and SUPG(Streamline Upwind Petrov Galerkin) scheme was used in the conversion equation. The experiment proves this method has a good stabilization and accuracy.
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Received: 20 May 2009
Published: 26 February 2010
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