LI Zhuo1,2, SHI Qingfeng1,2, WANG Xin1,2, GAO Yanze1,2, SHI Rui3
1.School of Optics and Photonics, Beijing Institute of Technology, Beijing 100081, China;
2.Beijing Key Lab for Precision Optoelectronic Measurement Instrument and Technology, Beijing 100081, China;
3.Lanshi Optics Technology (Beijing) Co., Ltd., Beijing 100081, China
Abstract：This paper demonstrates a cryogenic infrared scene generation technology based on MEMS thin film transducer which based on the passive optical heating device. The scene writing system can be put outside the cryogenic vacuum chamber, without radiation interference of electronics and thermal insulation layer in the cryogenic environment, so the passive film transducer can simulate the lowest temperature to be infinitely close to the ambient temperature in low temperature environment. The theoretical model and experimental equipment are established, and the spatial and temporal properties of the thin film transducer at low temperature are tested. In 7.5～14μm waveband, when the optical power density at the incident is 0.0275W/mm2, the ambient temperature decreases from 233 K to 173 K, and the simulated temperature range increases from 49.67 K to 85.2 K. At the ambient temperature of 173 K, when the written optical power increases to 0.1233W/mm2, the simulated temperature range increases to 367K. When the ambient temperature drops from 233 K to 173 K, the rise time of the film transducer increases from 6.52 ms to 6.73 ms, and the decline time also accelerates from 6.75 ms to 6.22 ms. The low temperature experimental results show that the lower the ambient temperature is, the larger the temperature range of the film transducer can be simulated, and the faster the time response is. The experiment indicates that the infrared thin film has a broad prospect in the cryogenic infrared scene generation technology.
李卓, 时庆峰, 王欣, 高彦泽, 施蕊. 低温红外场景生成技术研究[J]. 空天防御, 2020, 3(4): 1-7.
LI Zhuo, SHI Qingfeng, WANG Xin, GAO Yanze, SHI Rui. Cryogenic Infrared Scene Generation Technology. Air & Space Defense, 2020, 3(4): 1-7.
