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Virtual Thermal Test System Based on Simulink and Comsol Co-simulation |
ZHOU Xingguang, WANG Zhaoxi, LIU Bo, LIANG Di, LIU Shiling, FU Ye |
Shanghai Spaceflight Precision Machinery Institute, Shanghai 201600, China |
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Abstract A virtual thermal test system was produced using the co-simulation of Simulink and Comsol to realize the complete virtualization of the thermal test. The co-simulation technology enabled the comprehensive simulation analysis of the control system, electric field, and thermal field. The data states of every single observation point can be acquired directly, including the output states information both of the power amplifier and the heater and the thermal states information of the test. The virtual thermal test system has a predictive and guiding role for engineering thermal tests and is capable to simulate the thermal environment beyond the actual existing thermal environment, thus providing a basic tool for the future development of models.
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Received: 30 November 2022
Published: 06 July 2023
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