Flexible, Transparent and Conductive Metal Mesh Films with Ultra-High FoM for Stretchable Heating and Electromagnetic Interference Shielding

doi:10.1007/s40820-023-01295-z

Abstract

Abstract:

Despite the growing demand for transparent conductive films in smart and wearable electronics for electromagnetic interference (EMI) shielding, achieving a flexible EMI shielding film, while maintaining a high transmittance remains a significant challenge. Herein, a flexible, transparent, and conductive copper (Cu) metal mesh film for EMI shielding is fabricated by self-forming crackle template method and electroplating technique. The Cu mesh film shows an ultra-low sheet resistance (0.18 Ω □⁻¹), high transmittance (85.8%@550 nm), and ultra-high figure of merit (> 13,000). It also has satisfactory stretchability and mechanical stability, with a resistance increases of only 1.3% after 1,000 bending cycles. As a stretchable heater (ε > 30%), the saturation temperature of the film can reach over 110 °C within 60 s at 1.00 V applied voltage. Moreover, the metal mesh film exhibits outstanding average EMI shielding effectiveness of 40.4 dB in the X-band at the thickness of 2.5 μm. As a demonstration, it is used as a transparent window for shielding the wireless communication electromagnetic waves. Therefore, the flexible and transparent conductive Cu mesh film proposed in this work provides a promising candidate for the next-generation EMI shielding applications.

Key words: Metal mesh, Transparent conductive film, Stretchable heater, Electromagnetic interference shielding

Zibo Chen, Shaodian Yang, Junhua Huang, Yifan Gu, Weibo Huang, Shaoyong Liu, Zhiqiang Lin, Zhiping Zeng, Yougen Hu, Zimin Chen, Boru Yang, Xuchun Gui. Flexible, Transparent and Conductive Metal Mesh Films with Ultra-High FoM for Stretchable Heating and Electromagnetic Interference Shielding[J]. Nano-Micro Letters, 2024, 16(1): 92-.

Zibo Chen, Shaodian Yang, Junhua Huang, Yifan Gu, Weibo Huang, Shaoyong Liu, Zhiqiang Lin, Zhiping Zeng, Yougen Hu, Zimin Chen, Boru Yang, Xuchun Gui. [J]. Nano-Micro Letters, 2024, 16(1): 92-.

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Figures/Tables 5

Fig. 1 Fabrication and characterization of Cu mesh film. a Schematic diagram of the fabrication process for a Cu mesh film. b Digital photograph of a 3 × 2.5 cm² Cu mesh film. c OM image of Cu mesh film. d, e SEM images of the Cu mesh. f Cell size distribution of Cu mesh. The number of statistical cells exceeds 1000. g Thickness distribution of a Cu mesh measured by step profiler

Fig. 2 Optoelectronic characterization of Cu mesh films with different coverage ratios and thicknesses. a SEM images of Cu mesh with different coverage ratios. b Relationship between line width and coverage ratio of the Cu mesh. c Sheet resistance and optical transmittance at 550 nm of the films with different coverage ratios. d Thicknesses of the Cu mesh at different electroplating time. e Sheet resistance and optical transmittance at 550 nm of the films with different thicknesses. f FoM of the Cu mesh film with different thicknesses (up), and coverage ratios (down). g Comparison of sheet resistances and transmittances between different TCFs, which reported in the literature and this work. The dashed line indicates that FOM is equal to a specific value listed in the figure. Details about the literatures are listed in Table S3

Fig. 3 Mechanical properties of the flexible Cu mesh films. a ΔR/R₀ (ΔR is the change in resistance value, R₀ is the initial resistance) of Cu mesh films at different bending radius. Insets are the digital photographs of initial and bending states. b ΔR/R₀ of Cu mesh film during 1000 bending cycles at the bending radius of 4 mm. c ΔR/R₀ of Cu mesh films with different coverage ratios at varying tensile strain (ε). d ΔR/R₀ of Cu mesh films during 1,000 tensile cycles at different tensile strains. e OM images of a Cu mesh film under different stretching states

Fig. 4 Electrothermal properties of the flexible Cu mesh film (Coverage ratio = 15.3%, thickness = 2.5 μm). a Time-dependent surface temperatures of Cu mesh film under different supplied voltages. b Corresponding current values to different supplied voltages (Compliance currents = 1.05 A). c Infrared images of the Cu mesh film at different supplied voltages. d Time-varying surface temperature of the Cu mesh films with different coverage ratios at 0.50 V supplied voltage. e Temperature stability of the film during 5 h under continuous 0.50 V voltage supplied. Insets shows that a Cu mesh film is used as a heater. f Thermal response of the film under cycle-to-cycle voltage on-off at 0.50 V. g Infrared images of the Cu mesh film under different tensile strains (ε = 0%, 10%, 20% and 30%)

Fig. 5 EMI shielding performance of the flexible Cu mesh films. a Total EMI SE of the Cu meshes (Coverage ratio = 17.4%) with different thicknesses in the X-band (8.2-12.4 GHz). b Total EMI SE of Cu mesh (2.5 μm) with different coverage ratios in the X-band. c Average reflection (SE_R), absorption (SE_A), and total EMI SE (SE_T) of the films with different coverage ratios. d Contributions of SE_R and SE_A to SE_T for a 2.5 μm and 18.6% coverage ratio Cu mesh film. e Total EMI SE of Cu mesh at initial state and after 1000 bending cycles at the radius of 4 mm. Insets are the schematic diagrams of bending. f Comparison of the EMI SE and transmittance of this work with other materials in the literature. The details are listed in Table S4. Demonstration for shielding wireless communication electromagnetic waves. g Standby mode of two watches. h Dialing state of two watches when A was calling to B. i State of two watches when A was dialing to B which was placed in an aluminum box with an opening window. j State of two watches when A was dialing to B when the Cu mesh film was tightly attached to the opening window

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