Authors in [
35] investigated the possibility to produce MgB
2 in three-dimensional structures via HPCVD on Al
2O
3 cylindrical substrates. The 10 μm film exhibited
$T_C$39K, and
$J_C$10
5A/cm
2 in self-field. Reduction of
$J_C$ is linked to inhomogeneity of films caused by non-epitaxial growth, Volmer-Weber modes, and high deposition rates. Besides, film properties were majorly affected by the inability to control the Mg vapor pressure in the HPCVD reactor. Such a factor culminated in decreasing the in-situ reaction rate of MgB
2 from Mg vapor and B
2H
6. As a result, deposits of both unreacted Boron and Magnesium were found on the Al
2O
3 substrate. The work presented in [
36] built upon [
35] concerning HPCVD of MgB
2 films on stainless steel cylinders, where authors presented a model to predict the feasibility of MgB
2 films in shielding magnetic fields with effectiveness of 65 dB.In such a case, the reported
$T_C$37.5K with
$J_C$7.6×10
6A/cm
2 at 10 K, and 4.6×10
6A/cm
2 at 20 K both in self-field. MgB
2 thin films were grown on Al
2O
3 with ZnO layers via HPCVD [
37]. Different buffer layer thicknesses (i.e., 0, 9 nm, 15 nm, 23 nm, and 40 nm), were shown to improve
$J_C$. ZnO layers diffused with MgB
2 throughout HPCVD, originating flux pinning centers in grain boundaries and point defects; hence improving
$J_C$. Anisotropy analysis in off-axis MgB
2 [0 0 1] c-axis thin films on MgO [2 1 1] substrates via HPCVD perpendicular planes was reported in [
38]. Through a Van der Pauw configuration, resistivity ratio values at both 40 K and 200 K were obtained with linear four-probe, refined, and simplified circuit models for a 40 nm thick MgB
2 layer. In [
39], authors demonstrated thin films of MgB
2 on C-terminated 6H-SiC present better grain connectivity compared to Si-terminated in HPCVD. The study utilized low B
2H
6 gas flow rate (1-2sccm), high H
2 flow (400 sccm) and maintained pressure of 40 Torr. The oxidation of surface Si atoms and posterior polishing removed Si, then Si-C bilayer on top. The thicker film (10.7 nm) grown on Si presented
$T_C$ of 37.8 K as opposed to the 36.4 K on C-terminated substrate. The reported 1 nm RMS roughness of the film on the C-terminated substrate was significantly lower than the 2.4 nm measured for the MgB
2 film on Si. Electrical resistivity at 42 K is 7 μΩ.cm for the MgB
2 thicker film on C-terminated substrate, and 17 μΩ.cm for the film on Si-terminated SiC. Authors in [
40] built upon [
39], and demonstrated the growth of a 2 nm MgB
2 film on C-terminated SiC substrate via HPCVD. A Molybdenum susceptor held Mg pellets heated to 730 °C, and the thickness calibration of MgB
2 films exhibited a deposition rate of 0.16 nm/s. For the 2 nm MgB
2 superconducting film, authors reported
$T_C$27.2K, and
$J_C$=2×10
7A/cm
2 at 3 K in self-field, and RMS roughness of 0.62 nm. Also, the growth of a MgO layer prior to the MgB
2 film deposition caused the substrate surface to become smoother, allowing for a smaller RMS roughness of the film.