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| Effect of Bonding Parameters and Chip/Substrate Thickness on Warpage of ChiponGlass Packaged with Nonconductive Film |
| ZHANG Jianhuaa,b,YUAN Fangb,ZHANG Jinsongb |
| (a. Key Laboratory of Advanced Display and System Applications of Ministry of Education;b. School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China) |
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Abstract Chiponglass (COG) is one of the promising technologies in liquidcrystaldisplay packaging. This paper executed a thermalstructure coupling field to simulate the warpage in thermocompression bonding with nonconductive film(NCF). The results reveal that the temperature of bonding head is the most important factor on COG warpage, the bonding force and temperature of substrate decline to influence COG warpage in sequence. Although increasing the thickness of substrate can decrease warpage, the change of IC thickness has not a strong relationship to warpage. This is expressed that the thicker substrate enhances the resistance of deformation for the whole COG module, which suppresses warpage effectively.4
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Received: 27 February 2009
Published: 29 January 2010
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