Application of S&HFMEA in Missileborne Embedded Software
GAO Weihua, LYU Guangqiang, CAO LuGuang,DING Xiaoqin,LI Feng
(1. School of Automation, Nanjing University of Science and Technology, Nanjing 210094, Jiangsu, China;
2. Shanghai Electro-Mechanical Engineering Institute, Shanghai 201109, China)
摘要结合嵌入式系统开发现状及弹载嵌入式软件特点，为提升弹载嵌入式软件可靠性，分析了弹载嵌入式软件设计在可靠性方面的薄弱环节，探究了可能影响弹载嵌入式软件可靠性的失效模式并对其进行分类。简述了失效模式、影响分析方法的发展,提出一种适用于弹载嵌入式系统的软硬件综合失效模式分析（failure mode and effects analysis，FMEA）方法。依托弹载嵌入式软件可靠性保障五维体系，应用软硬件综合FMEA方法对弹上计算机软件进行可靠性分析，阐述软硬件综合FMEA的原理、实施过程及要点。结果表明,软硬件综合FMEA方法对提高弹载嵌入式软件可靠性具有一定的有效性和实用性。
Abstract：This paper combines the development status of embedded systems and the characteristics of embedded software for missiles, analyzes the reliability weakness of the missileborne embedded software in order to improve its reliability, and explores the failure modes that may affect the reliability of the missileborne embedded software and classifies them. The development of failure mode and effects analysis (FMEA) is briefly described, and a software and hardware integrated FMEA (S&HFMEA) method for missleborne embedded systems is proposed. Relying on the fivedimensional system of missileborne embedded software reliability guarantee, it uses the S&HFMEA method to analyze the reliability of missileborne embedded software, and explains the principle, implementation process and key points of S&HFMEA. The results show that S&HFMEA has certain effectiveness and practicability for improving the reliability of missileborne embedded software.
