Impact of Crack Evolution in Solder Balls on Thermoelectric Model Under Electrical Stress

KUN HE, HUANPENG WANG, YUE TANG, JIE LIU, MUSHENG LIANG, YUEHANG XU

Integrated Circuits and Systems ›› 2025, Vol. 2 ›› Issue (1) : 36-45.

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Integrated Circuits and Systems ›› 2025, Vol. 2 ›› Issue (1) : 36-45. DOI: 10.23919/ICS.2025.3547670
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Impact of Crack Evolution in Solder Balls on Thermoelectric Model Under Electrical Stress

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 2(1): 36-45 https://doi.org/10.23919/ICS.2025.3547670

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