Ningsheng Xu, Fudan University, China
Zhonghan Deng, Vimicro International Co., China
Gianluca Setti, King Abdullah University of Science and Technology, Saudi Arabia
Ralph Etienne-Cummings, Johns Hopkins University, USA
Ke Wu, Polytechnique Montreal, Canada
Xiaomin Liu, Documentation and Information Center of the Chinese Academy of Sciences, China
Yimao Cai
Peking University, China
caiyimao@pku.edu.cn
Deepu John
University College Dublin, Ireland
deepu.john@ucd.ie
Bo Zhao
Zhejiang University, China
zhaobo@zju.edu.cn
Milin Zhang
Tsinghua University, China
zhangmilin@tsinghua.edu.cn
Yanan Sun
Shanghai Jiao Tong University, China
sunyanan@sjtu.edu.cn
Jun Zhou
University of Electronic Science and Technology of China (UESTC), China
zhoujun123@uestc.edu.cn
Wei Mao
Xidian University, China
maowei@xidian.edu.cn