Thermal Stress Analysis and Key Influencing Factors for the EMIB in Chiplet Packaging

YAN ZHOU, JUN WANG

Integrated Circuits and Systems ›› 2025, Vol. 2 ›› Issue (1) : 28-35.

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Integrated Circuits and Systems ›› 2025, Vol. 2 ›› Issue (1) : 28-35. DOI: 10.23919/ICS.2025.3547674
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Thermal Stress Analysis and Key Influencing Factors for the EMIB in Chiplet Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 2(1): 28-35 https://doi.org/10.23919/ICS.2025.3547674

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