XIAOYAN GUI (Senior Member, IEEE) (Guest Editor) xy.gui@xjtu.edu.cn, received the Ph.D. degree from the University of California, Irvine, CA, USA, in 2011.

From 2008 to 2012, he was at Broadcom, Irvine, where he worked on high-speed SerDes transceiver design as a Design Engineer and Staff Scientist. In 2012, he joined the faculty at the School of Information and Electronics, Beijing Institute of Technology (BIT), Beijing, China, and later with the faculty at the School of Microelectronics, Xi’an JiaoTong University (XJTU), Xi’an, China, in 2017, where he is currently a Full Professor. He is the author of more than 60 journal and conference papers. His research interests include CMOS high-speed wireline and wireless communications integrated circuits design. He was the recipient of 2007 Henry Samueli Fellowship by the UCI School of Engineering, 2022 National Teaching Achievement Award in Higher Education by Ministry of Education of China, Best Student Paper Award at 2023 IEEE MTT-S IWS and Best Paper Award at 2023 IEEE ICTA.

Dr. Gui is the TPC Co-Chair in 2022 and TPC Chair in 2023 of IEEE ICTA.

LIN CHENG (Member, IEEE) (Guest Editor) eecheng@ustc.edu.cn, received the B.Eng. degree from the Hefei University of Tech- nology, Hefei, China, in 2008, the M.Sc. degree from Fudan University, Shanghai, China, in 2011, and the Ph.D. degree from the Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong, in 2016.

In 2018, he joined the School of Microelectronics, University of Science and Technology, where he is currently a Professor. He was a Postdoctoral Research Associate in the Depart- ment of Electronic and Computer Engineering, HKUST, from 2016 to 2018, and was an Intern Analog Design Engineer at Broadcom Limited, San Jose, USA, from 2015 to 2016. His research interests include power management and mixed-signal integrated circuits and systems, wireless power transfer circuits and systems, switched-inductor power converters and automotive ICs.

Dr. Cheng is a Member of the ISSCC Technical Committee and the Chair for the IEEE ICTA 2024 Technical Committee. He was the recipient of the IEEE Solid-State Circuits

Society Pre-doctoral Achievement Award during 2014-2015, Hong Kong Institution of Science 2018 Young Scientist Awards (Honorable Mention), and the Best Design Award at the IEEE ASP-DAC University Design Contest in 2020.