Integrated Circuits and Systems >

2024 , Vol. 1 >Issue 3: 137 - 143

DOI: https://doi.org/10.23919/ICS.2024.3499944

Original article

Break the Cold Barrier: An In-Depth Study on FPGA Performance and Design Optimization at Cryogenic Temperature

  • ZESONG JIANG , 1 ,
  • MUHAN ZHANG 1 ,
  • QINGYUN LIU 2 ,
  • RUNZE LIU 1
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  • 1 Institute of Advanced Technology, University of Science and Technology of China, Hefei 230026, China
  • 2 School of Information Science and Technology, University of Science and Technology of China, Hefei 230026, China
+ CORRESPONDING AUTHOR: ZESONG JIANG (e-mail:).

(Zesong Jiang and Muhan Zhang contributed equally to this work.)

Received date: 2024-09-13

  Revised date: 2024-11-05

  Accepted date: 2024-11-08

  Online published: 2025-01-09

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Abstract

This study explores the potential of Field-Programmable Gate Arrays (FPGAs) within the realm of cryogenic computing, which promises enhanced performance and power efficiency by reducing leakage power and wire resistance at low temperatures. Prior research has mainly adapted commercial FPGAs for cryogenic temperatures without fully exploiting the technology’s benefits, necessitating significant design efforts for each application scenario. By characterizing FPGA performance in cryogenic conditions and examining the influence of architectural parameters, we propose a Bayesian optimization-based framework for systematic FPGA architecture exploration to identify FPGA architectures that are optimally suited for cryogenic applications. The architectures we developed, aimed at operating efficiently at 77K, significantly outperform conventional FPGAs designed for room-temperature conditions in performance and power consumption.

Key words： Architecture exploration; Bayesian optimization; cryogenic computing; FPGA.

Cite this article

ZESONG JIANG , MUHAN ZHANG , QINGYUN LIU , RUNZE LIU . Break the Cold Barrier: An In-Depth Study on FPGA Performance and Design Optimization at Cryogenic Temperature[J]. Integrated Circuits and Systems, 2024 , 1(3) : 137 -143 . DOI: 10.23919/ICS.2024.3499944

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