LIN CHENG (Senior Member, IEEE) received the B.Eng. degree from the Hefei University of Technology, Hefei, China, in 2008, theM.Sc. degree from Fudan University, Shanghai, China, in 2011, and the Ph.D. degree from the Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong, in 2016.

In 2018, he joined the School of Microelectronics, University of Science and Technology, Hefei, where he is currently a Professor. He was a Postdoctoral Research Associate in the Department of Electronic and Computer Engineering, HKUST, from 2016 to 2018, and was an Intern Analog Design Engineer at Broadcom Limited, San Jose, CA, USA, from 2015 to 2016. His current research interests include power management and mixed-signal integrated circuits and systems, wireless power transfer circuits and systems, switched-inductor power converters, and automotive ICs.

Dr. Cheng is a member of the ISSCC Technical Committee and the Chair for the IEEE ICTA 2024 Technical Committee. He was the recipient of the IEEE Solid-State Circuits Society Pre-doctoral Achievement Award during 2014-2015, the Hong Kong Institution of Science 2018 Young Scientist Awards (Honorable Mention), and the Best Design Award at the IEEE ASP-DAC University Design Contest in 2020.

BO ZHAO (Senior Member, IEEE) received the Ph.D. degree from the Department of Electronic Engineering, Tsinghua University, Beijing, China, in 2011.

He was at the National University of Singapore and UC Berkeley from 2013 to 2018. Since 2018, he has been a Professor with the Institute of VLSI Design, Zhejiang University, Hangzhou, China. He has authored or coauthored more than 70 articles and book chapters. He holds more than 30 Chinese patents. His research interests include IoT radios, wireless power transfer, and wearable/implantable radios.

Dr. Zhao was the recipient of the 2017 IEEE TRANSACTIONS OF CIRCUITS AND SYSTEMS Darlington Best Paper Award, the Design Contest Award at the 2013 IEEE International Symposium on Low Power Electronics and Design, and the Best Associate Editor Award from IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I. He is an International Technical Program Committee (ITPC) member of ISSCC. He was the Publication Chair for the 2016 IEEE Biomedical Circuits and Systems Conference. He is the Chair of the IEEE Biomedical and Life Science Circuits and Systems Society, and has been an Associate Editor for IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS since 2024 and IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I during 2020-2023. He is also a Committee Member of IEEE/C/SM.